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  cystech electronics corp. spec. no. : k175 ld issued date : 20 1 5 . 04 . 10 revised date : page no. : 1 / 5 skm 0545 u ld cystek product specification 5 a mp . mos barrier rectifier skm 0545 u ld features ? 150 operating junction temperature ? softest, fast switching capability ? reduced ultra - low forward voltage drop (vf ) ; better efficiency and cooler operation. ? lead - free finish; rohs compliant ? halogen and antimony free. green device ? mcd technology provides a superior avalanche capability than schottky diodes mechanical data ? case: do - 201ad m olded plastic ? terminals: plated axial leads, solderable per mil - std - 750 method ? polarity: color band denotes cathode end. ? epox y: ul 94v - 0 rate flame retardant ? polarity : as marked. maximum ratings and electrical characteristics ( rating at 25 ? c ambient temperature unless otherwise specified. single phase, half wave, 60hz, resistive or inductive load. for capacitive load, derate current by 20%. ) parameter symbol min. typ. max. units maximum dc blocking voltage v dc 45 v maximum recurre nt peak reverse voltage v rrm 45 v maximum rms voltage v rms 32 v maximum instantaneous forward voltage at i f =1 5 a t c =25 f 0. 4 6 0. 49 v t c =125 0. 4 2 0. 45 maximum instantaneous v r = 45 v, t c =25 i r 60 300 a v r = 45 v, t c =125 15 35 ma i f(av) 5a v rrm 45v v f at 125 c 0.42v tj 150 c
cystech electronics corp. spec. no. : k175 ld issued date : 20 1 5 . 04 . 10 revised date : page no. : 2 / 5 skm 0545 u ld cystek product specification maximum average forward rectified current @ t c =100 i f(av) 5 a non - repetitive peak forward surge current @ i fsm 120 a 8.3ms single half sine wave superimposed on rated load (jedec method) peak repetit ive reverse surge current (2us - 1khz) i rrm 2 a storage temperature range t stg - 5 5 1 50 operating junction temperature range t j - 5 5 1 50 thermal data parameter symbol value unit typical thermal resistance, junction - to - ambient (1) r th,j - a 60 ? c / w typical resistance, junction - to - lead (2) r th,j - l 10 ? c /w note 1 . 10mm lead length between copper pad 2 . thermal resistance, junction to lead, vertical pcb mounted, 0.375(9.5mm) lead length
cystech electronics corp. spec. no. : k175 ld issued date : 20 1 5 . 04 . 10 revised date : page no. : 3 / 5 skm 0545 u ld cystek product specification typical characteristics
cystech electronics corp. spec. no. : k175 ld issued date : 20 1 5 . 04 . 10 revised date : page no. : 4 / 5 skm 0545 u ld cystek product specification recommen ded wave soldering condition product peak temperature soldering time pb - free devices 260 +0/ - 5 ? c 5 +1/ - 1 seconds recommended temperature profile for ir reflow profile feature sn - pb eutectic assembly pb - free assembly average ramp - up rate (tsmax to tp) 3 ? c /second max. 3 ? c /second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 ? c 150 ? c 60 - 120 seconds 150 ? c 200 ? c 60 - 180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 ? c 60 - 150 se conds 217 ? c 60 - 150 seconds peak temperature(t p ) 240 +0/ - 5 ? c 260 +0/ - 5 ? c time within 5 ? c of actual peak temperature(tp) 10 - 30 seconds 20 - 40 seconds ramp down rate 6 ? c /second max. 6 ? c /second max. time 25 ? c to peak temperature 6 minutes max. 8 minut es max. note : all temperatures refer to topside of the package, measured on the package body surface.
cystech electronics corp. spec. no. : k175 ld issued date : 20 1 5 . 04 . 10 revised date : page no. : 5 / 5 skm 0545 u ld cystek product specification important notice: ? ? ? semiconductor products are not warranted to be suitable for use in life - support applications, or systems. ?


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